Dae Joon Kung
Sungkyunkwan University, South Korea
Title: Development of universal transfer technique for chemical vapor deposited 2-dimensional films
Biography
Biography: Dae Joon Kung
Abstract
Transfer and integration of nanostructures onto desirable substrates is the prerequisite for their fundamental studies and practical applications. Conventional transfer techniques involving stamping, lift-off and/or striping are greatly limited by the process-specific shortcomings, including the requirement for chemical etchant or high-temperature annealing and the introduction of surface discontinuity and/or contamination that can greatly deteriorate the intrinsic properties of the transferred materials. We have developed a universal transfer method implementable at mild conditions to transfer large area 2-Dimensional (2D) materials grown by chemical vapor deposition method onto various substrates. This technique not only allows the effective transfer to an arbitrary target substrate with a high degree of freedom, but also avoids PMMA etching thereby maintaining the high quality of the transferred 2D materials with minimum contamination. We applied this method to transfer various 2D materials grown on different rigid substrates of general interest, such as graphene on copper foil, h-BN on platinum and MoS2 on SiO2/Si. We believe that our method can facilitate the development of nanoelectronics by accelerating the clean transfer and integration of low-dimensional materials into multidimensional structures.